Analog Devices Launches CodeFusion Studio™ 2.0 to Simplify AI-Enabled Embedded Development

• New End-to-end AI workflow support with bring-your-own-model capability, model checks and performance profiling enables rapid deployment across ADI’s full hardware portfolio.
• New Unified configuration tools, multi-core support and integrated debugging streamline development across heterogeneous systems.
• New Zephyr-based modular framework for runtime AI/ML profiling and layer-by-layer analysis enhances the open source foundation, eliminating toolchain fragmentation and reducing complexity.

Analog Devices, Inc. (Nasdaq: ADI), a global leader in semiconductor innovation, today launched CodeFusion Studio™ 2.0, a significant upgrade to its open source embedded development platform. Designed to simplify and accelerate the development of AI-enabled embedded systems, CodeFusion Studio 2.0 introduces advanced hardware abstraction, seamless AI integration and powerful automation tools to streamline the journey from concept to deployment across ADI’s diverse processors and microcontrollers.

“The next era of embedded intelligence requires removing friction from AI development,” said Rob Oshana, Senior Vice President of the Software and Digital Platforms group, ADI. “CodeFusion Studio 2.0 transforms the developer experience by unifying fragmented AI workflows into a seamless process, empowering developers to leverage the full potential of ADI's cutting-edge products with ease so they can focus on innovating and accelerating time to market.”

Empowering Developers with End-to-End AI Workflows

CodeFusion Studio 2.0 now supports complete AI workflows, enabling developers to bring their own models and deploy them efficiently across ADI’s processors and microcontrollers—from low-power edge devices to high-performance DSPs (digital signal processors). The latest platform, based on Microsoft’s Visual Studio Code, features a built-in model compatibility checker, performance profiling tools and optimization capabilities that are designed to ensure robust deployment and an accelerated time-to-market.

A new Zephyr-based modular framework enables runtime performance profiling for AI/ML workloads, offering layer-by-layer analysis and seamless integration with ADI’s heterogeneous platforms. This encapsulation of toolchains simplifies machine learning deployment and enhances system-level performance insights.

Unified Development Experience

The updated CodeFusion Studio System Planner now supports multi-core applications and expanded device compatibility, while unified configuration tools reduce complexity across ADI’s hardware ecosystem. Developers benefit from integrated debugging capabilities, including Core Dump Analysis and GDB (GNU debugger) support, making troubleshooting faster and more intuitive.

ADI Future Proofs Its Digital Roadmap

CodeFusion Studio 2.0 is the latest milestone in ADI’s open-source embedded development platform, embodying its commitment to delivering developer-first tools that simplify complexity and accelerate innovation. As ADI expands its digital roadmap, future releases will continue to push the boundaries of embedded intelligence, bringing deeper hardware-software integration, expanded runtime environments and new capabilities tailored to evolving developer needs as they experiment with physical AI.

“Companies that deliver physically aware AI solutions are poised to transform industries and create new, industry-leading opportunities. That’s why we’re creating an ecosystem that enables developers to optimize, deploy and evaluate AI models seamlessly on ADI hardware, even without physical access to a board,” said Paul Golding, Vice President of Edge AI and Robotics, ADI. “CodeFusion Studio 2.0 is just one step we’re taking to deliver Physical Intelligence to our customers, ultimately enabling them to create systems that perceive, reason and act locally—all within the constraints of real-world physics.”

Availability

CodeFusion Studio 2.0 is now available for download. Developers can access the platform, documentation and community support at https://developer.analog.com/solutions/codefusionstudio

SmartSoC and CDAC's ChipIN Team Up to Offer Free Validation and Foundry Support for India’s Semiconductor Startups

SmartSoC Solutions Pvt. Ltd., a leading semiconductor and embedded engineering services company, has announced its collaboration with the ChipIN Center at Centre for Development of Advanced Computing (CDAC) to support India’s Design Linked Incentive (DLI) Programme. Through this initiative, SmartSoC will extend access to its advanced Post-Silicon Validation (PSV) services to DLI-registered startups and MSMEs on a pro-bono basis, while also offering multiple foundry options within the startup ecosystem.

This collaboration aims to address some of the most critical challenges faced by semiconductor startups in India— including access to diverse foundry services and world class backend validation and characterization infrastructure. By bridging these gaps, SmartSoC and CDAC will empower innovators to accelerate the journey from chip design to commercialization, reduce time-to-market, and strengthen their global competitiveness.

Bharath Desareddy, CEO of SmartSoC

“We are proud to be chosen as an engineering collaborator providing vital support to chip innovators in India. This is more than business—it’s our mission. We understand the tough journey from design to functional silicon. SmartSoC pledges to be the one-stop partner guiding startups through real-world complexities. Together, we will build a self-reliant India by leading the semiconductor revolution, not just participating in it.” said Bharath Desareddy, CEO of SmartSoC.

SmartSoC is one of the first Indian companies to partner with multiple foundries, aiming to provide startups with more options so they can select the best fit for their unique design needs. The Post-Silicon Validation services offered by SmartSoC allow startups to rigorously test silicon prototypes against functional, performance, and electrical benchmarks, ensuring compliance with international standards before mass production. These essential services, often unattainable for smaller players due to high costs, are being made accessible to help level the playing field, boost startup credibility, and support their journey to success.

This initiative complements SmartSoC’s ongoing contributions to the DLI Scheme, where the company serves as an engineering collaborator providing end-to-end post-silicon validation, SoC design and verification, physical design, embedded software development, and product engineering support. SmartSoC is actively contributing to advancing India's semiconductor research and development landscape and enabling faster commercialization of indigenous technologies.

“We are proud to partner with SmartSoC Solutions to provide Post-Silicon Validation services and multiple foundry options to startups under the DLI Scheme. This collaboration reinforces our commitment to empowering Indian startups and MSMEs with world-class semiconductor design infrastructure, accelerating innovation, and strengthening India’s self-reliant semiconductor ecosystem,” said Shri. E Magesh, Director General, CDAC, India.

“Providing multiple foundry options and Post-Silicon Validation through partners like SmartSoC ensures startups are able to confidently transition from design to deployable products. By offering complimentary access to expert labs, test infrastructure, and engineering services, initiatives like this reduce both cost and risk, enabling Indian startups to compete globally,” said Dr. SD Sudarsan, Executive Director, CDAC Bangalore Centre.

Aligned with the Government of India’s Semicon India vision and the larger Atmanirbhar Bharat (Self-Reliant India) mission, this collaboration underscores the importance of industry-government partnerships in building a robust innovation ecosystem.

About SmartSoC:

SmartSoC Solutions is a global provider of semiconductor design and embedded engineering services, specializing in turnkey project execution, custom ASIC development, and foundry services. With deep domain expertise and a solutions-driven approach, SmartSoC enables clients to accelerate growth and scale efficiently. Our collaborative, end-to-end approach enables leading semiconductor and system companies to streamline development cycles and bring differentiated silicon solutions to market with precision.

About ChipIN:

ChipIN is an initiative implemented by the Centre for Development of Advanced Computing (C-DAC) under the Design Linked Incentive (DLI) and Chip to Startup (C2S) programes of MeitY, Government of India, aimed at strengthening India’s semiconductor design ecosystem. The ChipIN Centre at CDAC Bangalore is one of the world’s largest and most advanced semiconductor design infrastructure facilities, providing state-of-the-art EDA tools, IPs, prototyping facilities, and high-performance computing (HPC) resources to Indian startups, MSMEs, and academic institutions. This initiative empowers innovators to design and develop complex semiconductor devices in a cost-effective manner. By fostering strong collaboration between industry, academia, and government, ChipIN serves as a national design infrastructure backbone, accelerating innovation, reducing design cycles, and driving indigenous semiconductor development—thereby laying the foundation for a self-reliant and globally competitive semiconductor ecosystem in India.

SoftBank’s Graphcore Picks Bengaluru for £1bn AI Campus, 500 Jobs Incoming

Graphcore, now a wholly owned subsidiary of SoftBank Group, is making a major move in India with the launch of a new AI Engineering Campus in Bengaluru. Here's a quick breakdown of the announcement:

Graphcore's £1bn India Expansion

• Location: Bengaluru, India
• Investment: Up to £1 billion over the next 10 years
• Jobs Created: 500 new semiconductor roles
• Immediate Hiring: First 100 roles already open, spanning:
  • Silicon Logical Design
  • Physical Design
  • Verification
  • Characterization
  • Bring-up

This campus will be central to Graphcore’s efforts in building next-generation AI computing infrastructure, aligning with SoftBank’s broader ambition to lead in Artificial Super Intelligence platforms.

Graphcore: AI Chip Innovator

• Founded: 2016 in Bristol, UK by Nigel Toon and Simon Knowles
• Industry: Semiconductors and AI hardware
• Core Product: Intelligence Processing Unit (IPU) — a novel processor architecture designed specifically for machine learning workloads
• Mission: To enable innovators to build next-generation AI applications and democratize access to machine intelligence
• Ownership: Now a wholly owned subsidiary of SoftBank Group Corp, continuing to operate under the Graphcore name

Graphcore competes with companies like Nvidia in the AI compute space, and its IPU architecture is known for handling entire ML models inside the processor — a departure from traditional GPU-based systems.

AI Accelerator Comparison (2025) 

Feature / Chip	Graphcore IPU (Bow-200)	Nvidia Blackwell B200 GPU	Google TPU v6e (Trillium)	AMD MI350 GPU
Architecture	Massively parallel IPU tiles	GPU with Transformer Engine	Custom ASIC for ML workloads	GPU with unified memory
Memory	900 MB per IPU tile	180 GB HBM3e per GPU	32 GB HBM per chip	128 GB HBM3e
Bandwidth	~1.5 TB/s (system level)	Up to 8 TB/s	1.6 TB/s per chip	~5.2 TB/s
Compute (FP16)	~350 TFLOPS (system level)	4.5 PFLOPS	918 TFLOPS BF16	~2.5 PFLOPS
Compute (INT8)	Not optimized	9 PFLOPS	1.836 PFLOPS	~5 PFLOPS
Scalability	3D wafer-scale IPU pods	DGX B200 clusters	256-chip TPU pods	MI350 clusters
Target Workloads	Sparse ML, graph networks	Transformer-based LLMs	Large-scale ML training	HPC + AI inference
Power Efficiency	High for sparse workloads	Improved over H100	Optimized for datacenter	Competitive with Nvidia
Deployment	Graphcore IPU systems	Nvidia DGX platforms	Google Cloud TPU pods	Enterprise GPU servers

UST and Kaynes Semicon Partner to Set Up a Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India

UST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer. The investment arrangement lays the foundation for greater collaboration between the two firms as they work together to power the next era of electronics and Electric Vehicles (EVs), renewables, and consumer technology. Furthermore, the partnership advances India's ambition to become a leading semiconductor hub, promoting quality, reliability, and local value, while providing advanced solutions globally.

UST’s worldwide presence and existing semiconductor client base make it a valuable partner for Kaynes Semicon, creating opportunities for new customers to leverage the benefits of Indian assembly and testing. The partnership will also take advantage of UST’s digital engineering, AI-driven process improvements, and real-time data analysis, which are all essential for scale, reliability, and avoiding hidden costs.

Guided by the “Make in India” growth strategy, this collaboration comes as India’s semiconductor industry continues to mature, moving toward its long-term goals of self-reliance and next-generation technology leadership. The two leaders in electronics and engineering will further these efforts by establishing a Rs 3,300 crore world-class OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat. OSAT remains relatively new in India, and its successful development requires a combination of Kaynes’ experience in the sector and UST’s strengths in R&D and testing.

Krishna Sudheendra, CEO, UST

“This ambitious partnership between UST and Kaynes Semicon will help shape the future of semiconductor manufacturing in India. We are proud to participate in the “Make in India” initiative. Together, our two great companies will harness the strengths of the Indian market and build a formidable foundation for the country to become a key player in the global semiconductor industry,” said Krishna Sudheendra, Chief Executive Officer, UST.

Gilroy Mathew, COO, UST

“Kaynes Semicon is built around the same values as UST, and I am excited to strengthen ties between our two great companies. Together, we will collaborate to meet rising global demand by accelerating the development, manufacturing, and assembly of advanced semiconductor components in India,” said Gilroy Mathew, Chief Operating Officer, UST.

"Our partnership with UST brings together world-class manufacturing and digital engineering expertise. This enables Kaynes Semicon to deliver advanced OSAT solutions while strengthening India’s self-reliant semiconductor ecosystem," said Raghu Panicker, Chief Executive Officer, Kaynes Semicon Private Limited.

​"Kaynes Semicon’s collaboration with UST is a proud milestone for the “Make in India” mission. Together, we are creating a platform that will set benchmarks for semiconductor assembly, testing, and innovation, not just for India but for the global market," said Ramesh Kannan, Promoter & Executive Vice Chairman, Kaynes Technology India Limited.

Kaynes Semicon is a wholly owned semiconductor subsidiary of Kaynes Technology India Ltd. Incorporated in 2008, Kaynes Technology is a leading end-to-end and IoT solutions-enabled integrated electronics manufacturing company, and is a listed company (BSE: 543664, NSE: KAYNES) in India.

Made-in-India Radar Tech Takes Off As Tata Joins FermionIC to Launch Breakthrough Chip

FermionIC Design, a Bangalore-based fabless RFIC innovator, has teamed up with Tata Electronics to deliver the country’s first 4-Channel X-Band Beamformer IC, model FD3R4411, tailored for TDD Phased Array Radar systems, reported Business Standard. 

The 4-Channel X-Band Beamformer chip is a powerhouse of precision engineering, especially for radar and satellite systems. A Beamformer IC is a specialized chip used in phased array antennas, which are critical for radar, satellite communication, and surveillance systems. It can control four independent antenna elements.

What Does It Actually Do?

• Beam Steering: Adjusts signal direction by changing phase across channels.
• Transmit & Receive Control: Switches between sending and receiving signals in TDD (Time Division Duplex) mode.
• Compact Integration: Combines multiple functions—phase shifting, gain control, power detection—into one chip.
• Precision: Offers up to 360° phase control and >31 dB gain adjustment, with fine resolution.

Why It Matters

• Enables smaller, smarter radar systems.
• Reduces size, weight, and power (SWaP)—ideal for drones, satellites, and mobile platforms.
• Supports real-time beam shaping for advanced surveillance and imaging.

Key Highlights of the Partnership:

• Indigenous Innovation: The FD3R4411 is fully designed and owned in India, marking a major leap in domestic radar electronics capability.
• Advanced Applications: It supports compact, high-performance phased array systems used in:
• Ranging radars
• Imaging radars
• Surveillance platforms
• Manufacturing Synergy: Tata Electronics acts as the OSAT (Outsourced Semiconductor Assembly and Test) partner, handling:
• Flip-chip ball grid array (FcBGA) assembly
• Wafer-level testing
• Post-silicon validation

Strategic Impact:

• Volume Production: Scheduled to begin in Q4 2025, with nearly the entire manufacturing value chain remaining within India.
• Defense & Surveillance Boost: Already adopted by multiple public and private organizations, the IC accelerates India’s push for indigenous radar solutions.
• Tech Sovereignty: This collaboration signals a scalable pathway for high-frequency radar electronics, strengthening India’s strategic independence.

About FermionIC Design

Founded in 2020, by Abhra Bagchi, Shabaaz Syed, Prasun Bhattacharyya and Gautam Singh, FermionIC Design Pvt. Ltd. is emerging as a key player in India’s push toward indigenous semiconductor innovation—especially in the high-frequency radar domain.

Based in Bangalore, the company operates as a fabless RFIC (Radio Frequency Integrated Circuit) design house, meaning it focuses on chip design while outsourcing manufacturing.

Company Snapshot: FermionIC Design

Attribute	Details
Founded	2020
Location	Bengaluru, India
Founders	Abhra Bagchi, Shabaaz Syed, Prasun Bhattacharyya, Gautam Singh
Funding Raised	$6 million across 2 rounds
Key Investors	RBA Finance Investment, Ashish Kacholia, Qualcomm, Lucky Investment Managers
Valuation (2025)	₹275 Crore
Stage	Seed
Employee Count	33 (as of May 2025)

Strategic Focus

• FermionIC specializes in RF and mixed-signal chipsets for radar, satellite communications, and 5G phased array systems.
• Their flagship product—the FD3R4411 X-Band Beamformer IC—is India’s first of its kind, designed for high-performance radar applications.
• They were also among the first cohort of India’s Design-Linked Incentive (DLI) program, reinforcing their role in building indigenous semiconductor capabilities.

Sachin-Backed RRP Electronics to Build One of India’s Largest Semiconductor Fabs in Navi Mumbai

• Company is going to set up fab facility with a capacity of 1.25 lakh wafers per month

RRP Electronics, a leading-edge powerhouse in semiconductors and backed by cricket legend Sachin Tendulkar, has secured 100 acres in Navi Mumbai as Chief Minister of Maharashtra Devendra Fadnavis presented Letter of Comfort for relocating a semiconductor fab from one of the world’s most established semiconductor companies in Sherman, Texas.

Devendra Fadnavis, Chief Minister lauding the development said, "This allotment of land firmly positions Maharashtra at the heart of India’s Semiconductor Mission roadmap. Our government is fully committed to extending all necessary support; be it in infrastructure, policy facilitation or skill development to ensure the success of this initiative.

The establishment of such a facility will not only accelerate industrial growth but also create significant employment opportunities, strengthen local supply chains and reinforce Maharashtra’s leadership as a hub for high-technology manufacturing in India.”

Mr. Rajendra Chodankar, Chairman of RRP Electronics Ltd said, “We are thankful to the Government of Maharashtra and Honourable Chief Minister and his team for the continued encouragement and support towards enabling Maharashtra in taking pioneering initiatives for the semiconductor ecosystem. This acquisition is a landmark step in our journey to make India self-reliant in semiconductors.”

A year after the launch of Maharashtra's first OSAT (Outsourced Semiconductor Assembly and Test) semiconductor manufacturing facility in Navi Mumbai, this marks a significant leap in RRP's growth journey, as one of the region’s largest and most advanced fab facility with a capacity to produce 1.25 lakhs wafers per month. Together, these steps place Maharashtra and India at the forefront of the global semiconductor value chain.

About RRP Electronics

RRP Electronics Ltd. stands at the forefront of cutting-edge packaging technologies, offering innovative solutions in semiconductor packaging. With a dedication to excellence, sustainability, and continuous advancement, RRP Electronics is committed to meeting the ever-evolving needs of the electronics sector. The company’s focus on providing high-performance and reliable packaging solutions positions it as a leader in propelling the technology landscape forward.

TCS Launches Chiplet Services to Fast-Track AI and 3D Packaging Designs

Tata Consultancy Services (TCS) has officially launched its Chiplet-Based System Engineering Services, marking a strategic move to support next-gen semiconductor design and bolster India’s ambitions as a global chip hub.

What Are Chiplets?

• Modular integrated circuits that can be combined to form advanced processors.
• Enable mix-and-match flexibility, reduce manufacturing costs, and accelerate time-to-market.

Key Features of TCS’s New Services

• Chiplet Tape-Out Acceleration: Faster design cycles with scalability and reduced latency.
• Advanced Packaging: Includes 2.5D/3D interposers and multi-layer organic substrates for compact, high-performance systems.
• UCIe & HBM Standards: Full-stack design and verification support for Universal Chiplet Interconnect Express and High Bandwidth Memory.
• AI Processor Integration: Already deployed with a North American firm to streamline multi-chip AI systems.

Strategic Timing

• India’s semiconductor market projected to grow from $45–50 billion (2024–25) to $100–110 billion by 2030.
• Backed by the ₹76,000 crore India Semiconductor Mission.
• TCS aims to be a key enabler in this transformation.

“Our chiplet-based engineering services will give semiconductor firms the flexibility and scalability they need to bring next-gen processors to market faster.”
— V Rajanna, President, Technology, Software and Services, TCS

Home to 20% of the world’s chip design engineers, India has semiconductor market that valued at $45–50 billion in 2024-2025, and is projected to more than double to $100–110 billion by 2030. Leading global players are investing in manufacturing and assembly facilities in India.

With government support through the ₹76,000 crore India Semiconductor Mission (ISM), India is positioning itself as a major global hub for chip design and manufacturing.


TCS’ new services are expected to strengthen this momentum by giving both Indian and international companies access to world-class expertise in chip-to-system engineering.

India’s SmartSoC Partners with France’s Cortus to Advance Secure Semiconductor Manufacturing

SmartSoC Solutions Private Limited, an Indian semiconductor design and product engineering company, today announced a strategic partnership with Cortus S.A.S., a French semiconductor company renowned for its cutting-edge Intellectual Property (IP) solutions in secure identification technologies. This partnership aims to drive innovation and accelerate the development and manufacturing of SIM cards, Smart cards, banking cards, and e-passport chip solutions in India, establishing a robust domestic capability in secure and mission-critical chip design.

Founded in India, SmartSoC Solutions has built a reputation as one of the fastest-growing engineering service companies, offering very large scale integration (VLSI), embedded software, Internet of Things (IoT), and AI-driven solutions to global customers. With over 1,400 engineers operating globally, SmartSoC Solutions has emerged as a key contributor to India's growing semiconductor ecosystem.

Cortus, headquartered in Montpellier, France, is a leading chip solution provider that leverages its broad IP portfolio, custom chip design capabilities, and advanced technologies to specialize in secure elements and semiconductor solutions. With over 17 billion chips deployed worldwide, Cortus technology powers a wide range of applications, including SIM cards, smart cards, banking cards, cryptocurrency, pay-TV, e-passports, as well as automotive, consumer, and industrial sectors.

Shipping approximately 1.2 billion chips annually, Cortus is now sharpening its focus on automotive, avionics, and artificial intelligence (AI) chipsets. It delivers complete system-on- chip (SoC) solutions designed to meet the stringent safety, security, and performance standards of modern vehicles. Cortus’ secure, energy-efficient, and scalable designs are trusted globally for identity protection, financial transaction security, and automotive-grade applications.

To support the growing demand for advanced, high-performance semiconductor solutions worldwide, Cortus has established strategic alliances across Europe, China, and India. These partnerships strengthen local design, development, and support capabilities, fostering closer collaboration with regional markets. Cortus is expanding this network to build a resilient, diversified ecosystem that accelerates innovation and delivers next-generation RISC-V solutions tailored for mission-critical and safety-sensitive applications.

Bharath Desareddy, CEO of SmartSoC Solutions

“SmartSoC Solutions is excited to collaborate with Cortus in bringing advanced secure chip technologies to India,” said Bharath Desareddy, CEO of SmartSoC Solutions. “This partnership marks a significant milestone in our mission to enable secure and self-reliant silicon manufacturing in India. With Cortus’ proven IP and expertise in secure identification and our deep design and engineering capabilities, we are confident of delivering world-class chipsets tailored for the Indian and global markets.”

“We see India as a key market for secure identity and financial transaction chips,” said Michael Chapman, CEO of Cortus. “Our collaboration with SmartSoC reflects Cortus’ commitment to building global partnerships for local innovation. We are excited to work with a like-minded partner to drive sustainable and secure chip production in the region.”

With the government’s growing emphasis on Atmanirbhar Bharat (self-reliant India), Production Linked Incentive (PLI) schemes, and recent policy pushes for secure digital identity and financial infrastructure, the timing is ripe for local innovation and manufacturing.

SmartSoC Solutions is a global provider of semiconductor design and embedded engineering services, specializing in turnkey project execution, custom ASIC development, and foundry services. With deep domain expertise and a solutions-driven approach, SmartSoC enables clients to accelerate growth and scale efficiently. Our collaborative, end-to-end approach enables leading semiconductor and system companies to streamline development cycles and bring differentiated silicon solutions to market with precision. Visit us at https://www.smartsocs.com

Cortus is a global fabless semiconductor company delivering high-performance RISC-V automotive chips up to 4 GHz capable of 4 instructions/cycle, with integrated AI inference optimized for computer vision. Cortus designs and supplies advanced RISC-V chips tailored for automotive, avionics, and AI-driven systems, combining high performance, energy efficiency, and functional safety to meet the most demanding industry requirements. Visit us at https://www.cortus.com

India’s Chip Ambitions Scale Up: L&T Semiconductor Buys Fujitsu Power IP for ₹110 Crore

India’s Fabless Chipmaker Accelerates Global Expansion with Japan Deal

In a move that signals India’s rising ambitions in the global semiconductor arena, L&T Semiconductor Technologies (LTSCT) has acquired the power module design assets of Fujitsu General Electronics (FGEL) for ¥2 billion (₹110 crore). The acquisition includes proprietary IP, patents, and R&D infrastructure focused on high-efficiency power electronics—critical for electric vehicles, industrial automation, and energy systems.

The deal, approved by FGEL’s board on June 9, is expected to close by September 23, pending regulatory clearance under Japan’s Foreign Exchange and Foreign Trade Act. LTSCT’s manufacturing partner, Kaynes Semicon Pvt Ltd, will simultaneously take over FGEL’s production facilities, creating a dual-pronged expansion into design and fabrication.

This acquisition marks a pivotal step in India’s journey toward semiconductor self-reliance,” said Sandeep Kumar, CEO of LTSCT and Chair of India’s Semiconductor Product Leadership Forum. “We’re not just buying assets—we’re inheriting decades of design excellence.

Why This Matters: Power Electronics as a Strategic Frontier

• Design patents and IP for high-voltage, high-efficiency modules
• R&D equipment for prototyping and testing
• A foothold in Japan’s advanced semiconductor ecosystem

FGEL, a legacy player in precision electronics, expects to record an extraordinary gain of ¥2 billion in its Q1 FY26 earnings.

Global Strategy: Fabless, Focused, and Expanding

• Targeting $500 million in revenue before considering an IPO
• Exploring entry into China by FY27, with outsourced production
• Investing ₹300 crore in R&D, with over a dozen products in development

This acquisition complements LTSCT’s broader strategy to become a global supplier of industrial and automotive chips, while anchoring India’s position in the semiconductor value chain.

India’s Semiconductor Vision: 100 Design Firms by 2035

As Chair of the Semiconductor Product Leadership Forum, Kumar is spearheading a national initiative to launch 100 new chip design firms by 2035. The goal: transform India from a backend service provider into a global IP powerhouse.

We’re building an ecosystem where design leads, not follows,” Kumar emphasized. “This deal is proof that Indian firms can compete—and win—on the global stage.

What’s Next

• Expand product portfolio across energy, mobility, and industrial sectors
• Deepen global partnerships in Japan, Europe, and the US
• Accelerate India’s transition from chip consumer to chip creator

As the world races to secure semiconductor supply chains, LTSCT’s strategic bet on design-first innovation could be a blueprint for India’s tech future.

ISM 2.0 Incoming: India Targets Full-Stack Innovation in Semiconductor Ecosystem

India’s semiconductor ambitions entered a transformative phase this week with the unveiling of the second edition of the India Semiconductor Mission (ISM 2.0), announced at the Semicon India 2025 summit.
Building on the ₹76,000 crore foundation laid by ISM 1.0, the new roadmap pivots from infrastructure creation to full-stack innovation, ecosystem integration, and indigenous product development.

From Fabs to Full Products: What ISM 2.0 Promises

Union Minister Ashwini Vaishnaw declared ISM 2.0 a “moment of pride,” presenting the first set of Made-in-India commercial-grade chips to Prime Minister Narendra Modi.
The chips, developed by CG Semi and student teams using Electronic Design Automation (EDA) tools, symbolize India’s transition from consumer to creator in the global chip race.

Key highlights of ISM 2.0 include:

• Expanded Incentives: Support now extends beyond fabs and OSATs to include capital equipment, materials, and ancillary industries such as gas and chemical suppliers.
• Product-Centric Focus: A significant portion of funding will be directed toward designing complete chipsets, ensuring that intellectual property (IP) remains within India.
• Silicon Carbide Priority: Proposals for SiC-based wafer manufacturing will be fast-tracked, given their strategic importance in EVs, defense, and power electronics.
• Revamped DLI Scheme: The Design-Linked Incentive program will now support larger domestic firms, advanced packaging, and risk capital access.

Global Confidence, Local Execution

The summit saw participation from 33 countries and over 350 exhibitors, including industry giants like ASML, Lam Research, and Merck Electronics.

Vaishnaw emphasized India’s reputation for respecting IP rights and fostering co-development, positioning the country as a trusted partner in a multipolar tech world.

Kai Beckmann, CEO of Merck Electronics, noted,

India builds resilience into global value chains by developing local capacity,” while MediaTek India’s MD Anku Jain stressed the role of startups in solving ecosystem gaps.

Economic and Strategic Impact

• Cost Advantage: Independent studies suggest India’s semiconductor production is already 15–30% more cost-effective than global benchmarks.
• Talent Pipeline: Over 60,000 engineering students have logged 13 million+ hours on EDA tools, with 278 universities participating in chip design programs.
• Deep Tech Alliance: A $1 billion fund has been launched to support frontier sectors including semiconductors, clean energy, biotech, and quantum technologies.

What’s Next?

With 10 semiconductor projects worth $18 billion underway and land allocated for the HCL-Foxconn JV fab, India is poised to become a global hub for high-value, mid-volume chip production.
The modernization of ISRO’s Semiconductor Laboratory in Mohali is also in motion, aiming to boost domestic tape-outs and export capacity.

Intel, Samsung’s China Chip Plants Targeted in New U.S. Export Rules

The U.S. Department of Commerce has officially revoked the Validated End-User (VEU) authorization for three major semiconductor firms operating in China:

1. Intel Semiconductor (Dalian) Co. Ltd.
2. Samsung China Semiconductor Co. Ltd.
3. SK Hynix Semiconductor (China) Ltd.

What VEU Authorization Meant

• The VEU program allowed Intel, Samsung, and SK Hynix to import U.S.-origin chipmaking equipment into China without individual export licenses.
• It streamlined operations for large-scale semiconductor manufacturing in China.

What Changed

• The U.S. Department of Commerce revoked VEU status for:
  • Intel Semiconductor (Dalian) Co. Ltd.
  • Samsung China Semiconductor Co. Ltd.
  • SK Hynix Semiconductor (China) Ltd.
• Companies now have 120 days before the waivers expire.
• After expiration, they must apply for individual licenses for each shipment.
• The U.S. has stated it will not approve licenses for expansion or tech upgrades at these Chinese facilities.

Strategic Implications

• Washington’s rationale: Part of a broader effort to tighten export controls and close “Biden-era loopholes.”
• China’s response: Condemned the move, calling it a misuse of export controls and warning of global supply chain disruptions.
• South Korea’s position: Working to minimize impact on Samsung and SK Hynix, which rely heavily on Chinese fabs for memory chip production.

This decision could reshape global chip supply chains and intensify the tech decoupling between the U.S. and China.

boAt to Co-Develop India-Made Semiconductor with HrdWyr; Tata Electronics to Lead Assembly

Representative Image

In a landmark move for India’s consumer electronics and semiconductor ecosystem, homegrown audio-tech giant boAt has made a strategic collaboration with Bengaluru-based chip design startup HrdWyr to co-develop a domestically designed and packaged chip, dubbed Indus 1011. The news was first reported by Moneycontrol on August 28, 2025, 9:44 AM IST.

The chip will be assembled and tested by Tata Electronics, marking a full-stack Indian effort in semiconductor innovation.

Inside the Chip: Indus 1011

The Indus 1011 is a MCU-class system-on-chip (SoC) engineered specifically for headset charging cases, with a focus on power and battery management. According to boAt, the chip delivers 20–30% improved charging efficiency, and future iterations will incorporate AI-powered battery optimization.

This is not just a chip—it’s a signal that India is ready to lead in fabless innovation,” said Aman Gupta, Co-founder of boAt, in an interview with Moneycontrol.

Made in India, for India

• Design & IP: Led by HrdWyr, a fabless startup specializing in low-power SoCs
• Assembly, Packaging & Testing (APT): Managed by Tata Electronics at its Hosur facility. 
• Deployment: boAt plans to integrate the chip into 25% of its product portfolio by 2026, starting with its premium Nirvana range

Strategic Implications

This collaboration marks the first India-designed and India-packaged chip for the wearables segment, reducing dependency on imports from Taiwan and China. It also shortens lead times and tightens supply chains for boAt, which has been scaling aggressively across global markets.

Ecosystem Ripple Effect

• The chip will be made available to other OEMs, fostering a broader domestic semiconductor ecosystem
• It sets a precedent for consumer brands investing in IP, not just product design
• The move aligns with India’s Semicon India initiative, which aims to position the country as a global semiconductor hub

HrdWyr is already prototyping a second-generation chip with Bluetooth stack integration, while Tata Electronics is expanding its APT capacity to support future consumer-grade silicon.

U.S. Govt Acquires 10% Stake in Intel for $8.9 Bn

President Donald Trump has confirmed that the United States government now owns 10% of Intel Corp, a move he called “a great deal for America and for Intel”.

Intel, the only American company capable of making advanced chips on U.S. soil, also said in a press release that the government made an $8.9 billion investment in Intel common stock, purchasing 433.3 million shares at a price of $20.47 per share, giving it a 10% stake in the company.

The US government acquired a 10% stake in Intel Corp through a combination of CHIPS Act funding and Pentagon-backed initiatives. This $8.9 billion infusion is aimed at fortifying domestic semiconductor production and reducing reliance on foreign supply chains. 

Deal Details

• Investment Value: $8.9 billion
• Share Price: $20.47 per share
• Shares Acquired: ~433.3 million

Funding Sources:

• $5.7B from CHIPS and Science Act grants
• $3.2B from Pentagon’s Secure Enclave program

Strategic Implications

• No Board Seat or Governance Rights: The government will not influence Intel’s internal decisions
• Warrant Clause: U.S. may acquire an additional 5% if Intel loses majority control of its foundry business
• National Security Focus: Trump emphasized the need to secure U.S. dominance in semiconductor manufacturing

Market Reaction

Intel shares surged 6–7% following the announcement, signaling investor optimism about the deal’s stabilizing effects.

Policy Shift

This move breaks with decades of hands-off government policy toward private corporations. Trump’s administration is now tying federal support to direct equity stakes, signaling a new era of economic statecraft.

Other Similar Tech Deals Globally

Several recent government-backed tech deals across the globe reflect a growing trend of governments stepping in to secure strategic digital infrastructure, bolster national security, and assert technological sovereignty. France has deepened its commitment to cloud sovereignty by investing in Bleu—a secure cloud venture spun off from Atos and co-owned with Orange. The French government’s support includes equity participation and long-term public sector contracts to ensure data localization and defense-grade infrastructure.

India has also made a notable move by channeling ₹3,000 crore into Bharat Electronics Ltd (BEL) via its defense modernization fund. This capital is earmarked for the development of AI-enabled battlefield systems and secure communication technologies, with the government maintaining oversight through board representation.

Germany, in a more enterprise-focused strategy, has backed the SAP specialist Cpro through a co-financing arrangement with private equity firm Egeria. The goal is to strengthen digital capabilities among small and medium-sized enterprises, aligning with Germany’s broader push for digital sovereignty in enterprise software.

China continues to lead in scale, expanding its state holdings in semiconductor giants like SMIC, Hua Hong, and Yangtze Memory. Through the National IC Fund Phase III, over $30 billion has been allocated to accelerate domestic chip manufacturing and reduce dependence on Western technologies. These deals collectively underscore a shift toward AI-first mergers, cloud infrastructure localization, and defense-tech fusion, with governments increasingly acting as strategic investors rather than passive regulators.

India Approves 23 Chip Design Projects Under DLI Scheme to Boost Semiconductor Innovation

India has taken a major step in its semiconductor journey by clearing 23 chip design projects under the Design Linked Incentive (DLI) scheme, part of the ₹76,000 crore Semicon India Programme, reported Business Standard. 

What Is the DLI Scheme?

• Launched in December 2021 as part of the ₹76,000 crore Semicon India Programme.
• Supports startups, MSMEs, and academic institutions in semiconductor design.
• Offers:
  • Up to ₹15 crore per project for prototyping and commercialization.
  • 4–6% incentives on net sales turnover for five years (capped at ₹30 crore).
  • Access to Electronic Design Automation (EDA) tools and IP cores.

Approved Chip Design Projects Under India’s DLI Scheme

While the full list of all 23 projects hasn’t been publicly disclosed, several key initiatives and companies have been highlighted by MeitY and media reports.

Notable Approved Projects

Company	Project Focus	Timeline
Vervesemi Microelectronics	ICs for weighing scales, bridge sensors, smart energy meters, BLDC motor controllers, EV/drone motor control, aerospace data acquisition	Sampling between end-2025 and 2026
SiCSem	Silicon carbide-based chip solutions	Details pending
Continental Device India Pvt. Ltd (CDIL)	Legacy and strategic semiconductor components	Details pending
3D Glass Solutions Inc.	Advanced packaging and interconnect technologies	Details pending
ASIP Technologies	System-in-package innovations for compact electronics	Details pending

Approved Projects Snapshot

• Applications include surveillance cameras, energy meters, microprocessor IPs, and networking systems.
• Vervesemi Microelectronics among key beneficiaries, developing:
  • Smart energy metering ASICs
  • Motor-control chips for EVs and drones
  • Data acquisition ICs for aerospace
  • BLDC controller ASICs for appliances

Strategic Impact

Impact Area	Details
Import Substitution	Reduces reliance on foreign chip designs
Job Creation	Thousands of new jobs across six states
Global Competitiveness	Positions India as a chip design leader
Manufacturing Synergy	Aligns with ₹1.6 trillion investment in fab projects under ISM

Why It Matters

• India is transitioning from a chip consumer to a global contributor in semiconductor design.
• The DLI scheme empowers domestic innovation and builds a resilient tech ecosystem.

The Ministry of Electronics and Information Technology (MeitY) is the central driving force behind India’s semiconductor design push through the Design Linked Incentive (DLI) Scheme. MeitY launched the DLI Scheme in December 2021 as part of the ₹76,000 crore Semicon India Programme to build a robust domestic semiconductor ecosystem.

MeitY has facilitated access to Electronic Design Automation (EDA) tools for 72 companies and 278 academic institutions, enabling advanced chip design capabilities.

Through the India Semiconductor Mission (ISM), MeitY also oversees manufacturing projects worth ₹1.6 trillion, ensuring synergy between design and production.

AMD Doubles Down on AI in Southeast Asia with Penang Mega Hub

Global semiconductor leader AMD has officially inaugurated its new mega facility in Bayan Lepas, Penang, marking a strategic leap in its commitment to AI and high-performance computing across Southeast Asia. The 209,000-square-foot campus is designed to accelerate AMD’s innovation pipeline, bolster regional talent, and reinforce Malaysia’s position as a rising force in the global semiconductor ecosystem.

A Strategic Investment in AI and Engineering Excellence

The Penang facility will serve as a regional hub for AMD’s cutting-edge research and development, focusing on adaptive computing, AI-driven architectures, and next-generation semiconductor technologies. With capacity for over 1,200 employees, the site features state-of-the-art engineering labs, collaborative workspaces, and advanced testing environments tailored to AMD’s expanding product portfolio.

“Malaysia has long been a cornerstone of AMD’s global operations,” said Victor Peng, President of AMD’s Adaptive and Embedded Computing Group. “This new facility reflects our confidence in the region’s talent and its growing importance in the future of AI and semiconductor innovation.”

Aligning with Malaysia’s National Tech Vision

The launch aligns closely with Malaysia’s New Industrial Master Plan 2030, the National Semiconductor Strategy, and the 13th Malaysia Plan, all of which aim to transform the country into a high-tech, knowledge-driven economy. AMD’s investment supports the government’s ambition to produce the first generation of “Made by Malaysia” chips—designed, developed, and tested locally.

Penang Chief Minister Chow Kon Yeow, who attended the launch event, hailed the facility as a “milestone in Penang’s evolution from a manufacturing base to a global innovation hub.”

Public-Private Synergy

The project received strong backing from InvestPenang and the Malaysian Investment Development Authority (MIDA), both of which emphasized AMD’s role in catalyzing local innovation, job creation, and global competitiveness.

“This is more than just a facility—it’s a signal to the world that Malaysia is ready to lead in the age of AI,” said Datuk Arham Abdul Rahman, CEO of MIDA.

Regional Impact and Future Outlook

AMD’s Penang expansion is expected to generate high-value employment, deepen local supply chains, and foster collaboration with universities and startups. It also complements AMD’s broader strategy to diversify its global footprint and tap into emerging markets with strong engineering talent.

As AI continues to reshape industries—from healthcare to autonomous systems—AMD’s Penang mega hub positions Southeast Asia at the forefront of this transformation.

SiMa.ai Advances Physical AI with Modalix™: Compact MLSoC for Robotics, AVs, and Automation

• SiMa.ai Launches Modalix™ to Tackle Power, Performance, and Integration Challenges in Physical AI

SiMa.ai, a leader in Physical AI solutions, today announced the production and immediate availability of its second-generation Machine Learning System-on-Chip (MLSoC™) – Modalix™ – designed to accelerate the scaling of Physical AI across industries.

As sectors such as robotics, autonomous vehicles, industrial automation, and aerospace increasingly push AI to the edge, they face a common challenge: achieving high performance within the strict power, size, and integration constraints of edge devices. Cloud-based AI often falls short due to latency and high energy consumption. Modalix™ addresses this gap by delivering high performance and accuracy under 10 watts, capable of running LLMs, transformers, CNNs, and GenAI workloads efficiently.

Performance, Flexibility, and Low Power

Built on a flexible Arm-based architecture with a native GenAI software stack, Modalix™ supports real-time perception, decision-making, and natural language interaction. Its compatibility with key interfaces such as camera, Ethernet, and PCIe makes it adaptable for use in robotics, automotive, industrial automation, aerospace and defense, smart vision, retail, and healthcare applications.

Complete Platform for Physical AI

Alongside Modalix™, SiMa.ai introduced:

• Pin-Compatible System-on-Module (SoM) – Developed with Enclustra, the compact, power-efficient SoM offers a drop-in replacement for leading GPU SoMs, integrating MIPI, memory, and essential I/O for rapid deployment.
• LLiMa™ Framework – A unified on-device platform for running LLMs, LMMs, and VLMs entirely offline, with features such as curated model zoo access, automated quantization/compilation, and support for agent-to-agent systems, MCP, and RAG.

The integrated Palette™ SDK software, enables developers to move from prototype to production quickly and cost-effectively.

Industry Partnerships Driving Innovation

“SiMa.ai’s Modalix showcases the scale of innovation possible on Arm’s flexible, high-performance, power-efficient compute platform,” said Ami Badani, Chief Marketing Officer, Arm. “By bringing AI and LLM capabilities to Physical AI applications at the edge, SiMa.ai is enabling smarter, faster, and more sustainable systems across industries.”

“The development of Physical AI applications requires validated, purpose-built silicon and software, only possible using advanced design solutions,” said Ravi Subramanian, Chief Product Management Officer, Synopsys. “Achieving a successful first tapeout of MLSoC Modalix illustrates the mission-critical role of Synopsys AI-powered design and IP.”

“This Enclustra–SiMa.ai SoM is more than just a module – it’s a ready-to-deploy Physical AI platform,” added Philipp Baechtold, CEO of Enclustra.

Leadership Perspective

“The era of Physical AI is here,” said Krishna Rangasayee, Founder and CEO of SiMa.ai. “With Modalix™ now in production, we’re accelerating its global adoption and simplifying on-device LLM deployment. Demand for our Modalix SoM is strong, and we’re enabling developers worldwide to bring GenAI to Physical AI systems faster than ever.”

TSMC’s advanced N6 process technology powers Modalix™, ensuring it meets stringent embedded power, thermal, and reliability demands. “TSMC is proud to collaborate with SiMa.ai to deliver advanced SoCs that meet the growing demand for Physical AI,” said Sajiv Dalal, President of TSMC North America.

About SiMa.ai

SiMa.ai is a leader in Physical AI, delivering a purpose-built, software-centric platform that brings best-in-class performance, power efficiency, and ease of use to Physical AI applications. Focused on scaling Physical AI across robotics, automotive, industrial automation, aerospace & defense, smart vision, and healthcare, SiMa.ai is led by seasoned technologists and backed by top-tier investors. Headquartered in San Jose, California. Learn more at www.sima.ai.

Tamil Nadu Launches India’s First School of Semiconductor to Power Chip Talent Pipeline

In a landmark move to position itself at the forefront of India’s semiconductor revolution, Tamil Nadu has launched the country’s first-of-its-kind School of Semiconductor, aimed at building a robust talent pipeline and fostering innovation across the chipmaking ecosystem, reported several media outlets including The Hindu. 

The initiative, part of the state’s ambitious Semiconductor Mission 2030, was unveiled at the Central Polytechnic Campus in Chennai, where the new Centre for Advanced Semiconductor Technologies will serve as the hub for cutting-edge training, research, and industry collaboration.

A ₹100 Crore Commitment to Chip Talent

Backed by a ₹100 crore seed grant from the Tamil Nadu government, the school will house India’s first in-situ semiconductor fab processing facility, enabling hands-on training for roles ranging from fab technicians to process engineers and fab managers.

In its first phase, the program will train 2,000 students under the state’s Naan Mudhalvan scheme, with a broader goal of skilling 4,500 candidates through short-term modules spanning 2 to 6 weeks.

Strategic Partnerships and National Vision

The initiative is anchored by IIT Madras, with active collaboration from leading semiconductor corporates. The state is also exploring alignment with the Ministry of Electronics and Information Technology (MeitY) to scale its impact nationally.

Training will span critical domains such as fabless chip design, equipment manufacturing, and startup incubation, with applications in electric vehicles, data centres, and space technology.

Aiming Global

Speaking at the launch, Industries Minister T.R.B. Rajaa emphasized the state’s global ambitions:

Our goal is to make Tamil Nadu the singular, indispensable source of semiconductor talent — nationally and globally. 

With this pioneering move, Tamil Nadu is not only addressing India’s semiconductor talent gap but also laying the foundation for a future-ready workforce capable of powering the next wave of technological innovation.

SixSense Raises $8.5 Mn Funding to Power AI-Driven Semiconductor Manufacturing

SixSense, a pioneer in AI for semiconductor manufacturing, announced a new round of funding led by Peak XV’s Surge (formerly Sequoia India & SEA), with participation from Alpha Intelligence Capital, Febe, and others.

Founded by engineers Akanksha Jagwani and Avni Agarwal, SixSense is tackling one of the semiconductor industry’s biggest challenges: turning raw production data from defect images to equipment signals into real-time intelligence that helps factories prevent quality issues, improve throughput, and produce more good chips from the same line.

With this new funding, SixSense will:

• Expand into chipmaking hubs across Malaysia, Taiwan, and the U.S.
• Partner with more AI-first inspection equipment makers to deliver deeper on-the-ground AI integration
• Invest in next-gen R&D — moving from isolated inspection tools to line-level intelligence, where multiple machines talk to each other through AI to improve factory-wide decisions in real time

As demand surges from AI, 5G, IoT, and electric vehicles, chipmakers are racing to build smaller, more complex chips — with far less room for error. “Making a single chip is one of the most demanding feats in modern manufacturing — it happens in cleanrooms thousands of times cleaner than hospital operating rooms and relies on precise coordination across hundreds of machines and thousands of ultra-sensitive steps,” said Akanksha Jagwani, Co-founder and CEO of SixSense. “Imagine trying to build a skyscraper out of microscopic Lego blocks, where a tiny shift in one brick — invisible to the eye — can collapse the whole structure. That’s what chip factories face every day.” Spotting early signs of failure before they spiral into costly defects or delays is a big challenge and that’s where AI becomes essential."

SixSense AI gives engineers the early warnings they need to fix problems. Their platform analyzes massive volumes of production data to detect, classify, and predict failure patterns — helping factories shift from reactive inspection to proactive control.

With SixSense, manufacturers can:

• Catch rare, small, and critical defects that humans often miss. 
• Avoid over-rejecting good chips — improving usable output (i.e., yield)
• Predict process drifts before they cause bigger failures

“Unlike traditional AI tools, SixSense is hardware-agnostic, explainable, and built for engineers — not data scientists,” said Avni Agarwal, Co-founder and CTO. “Process engineers can fine-tune models using their own fab data, deploy them in under two days, and trust the results — all without writing a single line of code. That’s what makes the platform both powerful and practical.”

SixSense already powers inspection lines at leading semiconductor manufacturers such as GlobalFoundries and JCET. Their customers have processed 100 million chips through the SixSense system and typically seen benefits such as : 30% faster production cycles 1%–2% higher yield by recovering chips that would’ve been wrongly rejected
Up to 20% fewer errors and >90% less manual effort

The platform is well integrated with major inspection equipment vendors that collectively cover over 60% of the market.

“We started with one step in the process — defect review — and quickly realized customers needed more,” said Akanksha. “Now we’re building the intelligence layer for the entire production line. It’s the foundation every modern fab will need.”

About SixSense: SixSense is an AI-powered platform transforming semiconductor manufacturing by turning raw production data into real-time factory intelligence that helps factories prevent quality issues, improve throughput, and produce more good chips. Founded by engineers Akanksha Jagwani and Avni Agarwal, the company helps chipmakers detect defects early, improve yield, and prevent costly production issues across increasingly complex fabrication lines. Unlike traditional AI tools, SixSense is hardware-agnostic, explainable, and built for process engineers - enabling quick deployment without coding. Backed by Peak XV’s Surge, Alpha Intelligence Capital, and Febe, SixSense is building the intelligence layer every modern fab needs from single inspection points to AI-driven line-level control.

Mass Production of World's First Non-Binary AI Chip Marks a New Era in Computing

China has commenced mass production of the world’s first non-binary AI chip, a groundbreaking development that challenges traditional computing limitations. Developed by Professor Li Hongge’s team at Beihang University, this innovation integrates binary logic with stochastic computing, paving the way for energy-efficient, high-performance AI hardware.

What Is a Non-Binary Chip?

For decades, computers have operated on binary logic, where every calculation relies on sequences of 0s and 1s. While highly efficient, binary computing faces growing challenges in power consumption and adaptability. A non-binary chip introduces Hybrid Stochastic Numbers (HSN) —a fusion of traditional binary numbers with probability-based values. This means that, instead of solely relying on rigid binary operations, these chips leverage randomness to optimize calculations, enhancing efficiency and fault tolerance.

A Solution to Major Tech Roadblocks

This non-binary chip addresses two critical hurdles in computing:

• The Power Wall: Traditional chips consume excessive energy, limiting scalability. Non-binary chips significantly reduce power consumption while maintaining speed.
• The Architecture Wall: Many experimental non-silicon chips struggle to integrate with existing systems. This new technology seamlessly aligns with CMOS-based architectures, ensuring compatibility.

Real-World Applications and Strategic Advantages

China is deploying these chips across various industries, including aviation, industrial control systems, and intelligent displays, enabling real-time AI processing with superior efficiency.

Moreover, the chip’s domestic production circumvents U.S. semiconductor export restrictions, reinforcing China’s push for technological self-reliance. The U.S. has imposed strict export restrictions on Nvidia’s AI chips, including the H20 model, which was specifically designed to comply with earlier regulations but is now banned. With China developing its own advanced AI chips, it can bypass these restrictions and continue AI development without relying on U.S. technology.

What’s Next?

This breakthrough could reshape the future of AI hardware, creating faster, smarter, and more energy-efficient systems. As global competition in semiconductor technology intensifies, non-binary computing may soon become the new standard.

Could this revolutionize AI-powered industries? Comment below to have your opinion.... 

Tata Electronics & BEL Partner for Homegrown Semiconductors

Tata Electronics and Bharat Electronics Limited (BEL) have signed a Memorandum of Understanding (MoU) to collaborate on semiconductor and electronics solutions, reinforcing India's push for self-reliance in the sector.

The agreement, formalized on June 5, 2025, at Bombay House in Mumbai, focuses on semiconductor fabrication, Outsourced Semiconductor Assembly and Test (OSAT), and chip design services.

BEL, a Navratna defence PSU, specializes in advanced electronics systems for strategic and civilian use, while Tata Electronics has been expanding its footprint in semiconductor manufacturing.

The partnership aims to develop indigenous solutions, including microcontrollers (MCUs), systems-on-chip (SoCs), and monolithic microwave integrated circuits (MMICs), reducing India's import dependency in critical electronics domains.

 

This collaboration aligns with India's broader vision of strengthening domestic capabilities in semiconductor technologies and fostering innovation in the electronics ecosystem. It’s a significant step toward enhancing India's role in global tech supply chains.

BEL has recently secured a ₹2,385 crore contract to supply Electronic Warfare (EW) Suites for Mi-17 V5 helicopters, enhancing operational survivability in hostile environments.

BEL has been involved in various defence projects, including next-generation air defence systems and electronic warfare solutions, showcased in Indian Army trials.

BEL has been involved in various defence projects, including next-generation air defence systems and electronic warfare solutions, showcased in Indian Army trials.